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NDM'14 Workshop Organization

date accessioned2020-03-12T22:38:18Z
date available2020-03-12T22:38:18Z
date issued2014
identifier other7017635.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089563?show=full
formatgeneral
languageEnglish
publisherIEEE
titleNDM'14 Workshop Organization
typeConference Paper
contenttypeMetadata Only
identifier padid8227801
subject keywordsbonding processes
subject keywordsn copper
subject keywordsn electronics packaging
subject keywordsn nanocomposites
subject keywordsn nanoparticles
subject keywordsn particle size
subject keywordsn reliability
subject keywordsn silver
subject keywordsn sintering
subject keywordsn thermal conductivity
subject keywordsn thermal expansion
subject keywordsn thermal resistance
subject keywordsn thermal shock
subject keywordsn thermomechanical treatment
subject keywordsn bulk thermal conductivity
subject keywordsn coefficient of thermal expansion
subject keywordsn copper micropowders
subject keywordsn electronics packaging
subject keywordsn heat dissipation
subject keywordsn high mechanical bond strength
subject keywordsn interfacial engineering
subject keywordsn low i
identifier doi10.1109/ECTC.2014.6897604
journal titleetwork-Aware Data Management (NDM), 2014 Fourth International Workshop on
filesize79984
citations0


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