contributor author | Pamsubsakul, A. | |
contributor author | Rijiravanich, P. | |
contributor author | Surareungchai, W. | |
date accessioned | 2020-03-12T22:38:16Z | |
date available | 2020-03-12T22:38:16Z | |
date issued | 2014 | |
identifier other | 7017442.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089546?locale-attribute=en&show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Mesoporous hybrid membrane based label free electrochemical immunoassay | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8227781 | |
subject keywords | electronics packaging | |
subject keywords | n thermal analysis | |
subject keywords | n JEDEC package level test | |
subject keywords | n chipsets junction temperature | |
subject keywords | n device skin temperature | |
subject keywords | n electronics component | |
subject keywords | n handheld device | |
subject keywords | n matrix method | |
subject keywords | n thermal analysis | |
subject keywords | n thermal characterization | |
subject keywords | n thermal coupling effect | |
subject keywords | n thermal network | |
subject keywords | n Electronic packaging thermal management | |
subject keywords | n Handheld computers | |
subject keywords | n Heating | |
subject keywords | n Load modeling | |
subject keywords | n Skin | |
subject keywords | n Temperature distribution | |
subject keywords | n Thermal analysis | |
identifier doi | 10.1109/ECTC.2014.6897587 | |
journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
filesize | 686327 | |
citations | 0 | |