| contributor author | Rungsirikunnan, C. | |
| contributor author | Chusri, Y. | |
| contributor author | Naiyanetr, P. | |
| date accessioned | 2020-03-12T22:38:14Z | |
| date available | 2020-03-12T22:38:14Z | |
| date issued | 2014 | |
| identifier other | 7017427.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089531?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Control system design for external continuous flow centrifugal VAD | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227758 | |
| subject keywords | ageing | |
| subject keywords | n aluminium | |
| subject keywords | n copper | |
| subject keywords | n corrosion resistance | |
| subject keywords | n failure analysis | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n lead bonding | |
| subject keywords | n semiconductor device packaging | |
| subject keywords | n semiconductor device reliability | |
| subject keywords | n Cu-Al | |
| subject keywords | n IMC thickness | |
| subject keywords | n Levenberg-Marquardt algorithm | |
| subject keywords | n Parr Bomb technique | |
| subject keywords | n X-ray microCT | |
| subject keywords | n accelerated testing | |
| subject keywords | n copper wire bonding technology | |
| subject keywords | n electrical resistance | |
| subject keywords | n failure assessment | |
| subject keywords | n failure mechanism | |
| subject keywords | n first-level interconnect | |
| subject keywords | n gold w | |
| identifier doi | 10.1109/ECTC.2014.6897573 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 1455483 | |
| citations | 0 | |