Sign language-Thai alphabet conversion based on Electromyogram (EMG)
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سال
: 2014شناسه الکترونیک: 10.1109/ECTC.2014.6897543
کلیدواژه(گان): flip-chip devices,n integrated circuit bonding,n integrated circuit packaging,n reflow soldering,n three-dimensional integrated circuits,n 2.5D packaging assembly,n 3D packaging assembly,n HAST behavior,n flip chip assembly,n highly silica filled one step chip attach material,n mass reflow processes,n organic fluids,n over collapse,n reflow soldering,n solder oxide removal,n solder wetting,n surface finishing,n thermal compression bonding,n v
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Sign language-Thai alphabet conversion based on Electromyogram (EMG)
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| contributor author | Amatanon, V. | |
| contributor author | Chanhang, S. | |
| contributor author | Naiyanetr, P. | |
| contributor author | Thongpang, S. | |
| date accessioned | 2020-03-12T22:38:11Z | |
| date available | 2020-03-12T22:38:11Z | |
| date issued | 2014 | |
| identifier other | 7017398.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089503?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Sign language-Thai alphabet conversion based on Electromyogram (EMG) | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227725 | |
| subject keywords | flip-chip devices | |
| subject keywords | n integrated circuit bonding | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n reflow soldering | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 2.5D packaging assembly | |
| subject keywords | n 3D packaging assembly | |
| subject keywords | n HAST behavior | |
| subject keywords | n flip chip assembly | |
| subject keywords | n highly silica filled one step chip attach material | |
| subject keywords | n mass reflow processes | |
| subject keywords | n organic fluids | |
| subject keywords | n over collapse | |
| subject keywords | n reflow soldering | |
| subject keywords | n solder oxide removal | |
| subject keywords | n solder wetting | |
| subject keywords | n surface finishing | |
| subject keywords | n thermal compression bonding | |
| subject keywords | n v | |
| identifier doi | 10.1109/ECTC.2014.6897543 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 1366534 | |
| citations | 0 |