Experience with Using a Performance Predictor during Development: A Distributed Storage System Tale
Publisher:
Year
: 2014DOI: 10.1109/ECTC.2014.6897474
Keyword(s): integrated circuit bonding,n integrated circuit interconnections,n integrated circuit packaging,n optimisation,n BVA manufacturing process,n BVA technology,n HVM,n PoP configuration,n bond via array technology,n critical assembly process steps,n high volume manufacturing,n package footprint,n package reliability,n size 0.24 mm,n size 14 mm,n test vehicle design optimization,n ultra-high bandwidth package-on-package,n vertical connections,n Ar
Collections
:
-
Statistics
Experience with Using a Performance Predictor during Development: A Distributed Storage System Tale
Show full item record
| contributor author | Costa, Lauro Beltrao | |
| contributor author | Brunet, Joao | |
| contributor author | Hattori, Lile | |
| contributor author | Ripeanu, Matei | |
| date accessioned | 2020-03-12T22:38:04Z | |
| date available | 2020-03-12T22:38:04Z | |
| date issued | 2014 | |
| identifier other | 7017327.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089432 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Experience with Using a Performance Predictor during Development: A Distributed Storage System Tale | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227644 | |
| subject keywords | integrated circuit bonding | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n optimisation | |
| subject keywords | n BVA manufacturing process | |
| subject keywords | n BVA technology | |
| subject keywords | n HVM | |
| subject keywords | n PoP configuration | |
| subject keywords | n bond via array technology | |
| subject keywords | n critical assembly process steps | |
| subject keywords | n high volume manufacturing | |
| subject keywords | n package footprint | |
| subject keywords | n package reliability | |
| subject keywords | n size 0.24 mm | |
| subject keywords | n size 14 mm | |
| subject keywords | n test vehicle design optimization | |
| subject keywords | n ultra-high bandwidth package-on-package | |
| subject keywords | n vertical connections | |
| subject keywords | n Ar | |
| identifier doi | 10.1109/ECTC.2014.6897474 | |
| journal title | oftware Engineering for High Performance Computing in Computational Science and Engineering (SE-HPCC | |
| filesize | 169927 | |
| citations | 0 |