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A novel pad conditioner and pad roughness effects on tungsten CMP

contributor authorDonghyun Lim
contributor authorHojoong Kim
contributor authorBongyoung Jang
contributor authorHonglae Cho
contributor authorJunyong Kim
contributor authorHasub Hwang
date accessioned2020-03-12T22:38:03Z
date available2020-03-12T22:38:03Z
date issued2014
identifier other7017318.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089424?show=full
formatgeneral
languageEnglish
publisherIEEE
titleA novel pad conditioner and pad roughness effects on tungsten CMP
typeConference Paper
contenttypeMetadata Only
identifier padid8227636
subject keywordscarbon nanotubes
subject keywordsn electroless deposited coatings
subject keywordsn nanocomposites
subject keywordsn nanofabrication
subject keywordsn nickel compounds
subject keywordsn oxidation
subject keywordsn scanning electron microscopy
subject keywordsn surface morphology
subject keywordsn surface treatment
subject keywordsn surfactants
subject keywordsn suspensions
subject keywordsn transmission electron microscopy
subject keywordsn ultrasonic applications
subject keywordsn C-NiP
subject keywordsn SEM
subject keywordsn TEM
subject keywordsn acid oxidation treatment
subject keywordsn carbon nanotube clusters
subject keywordsn chemical modification
subject keywordsn composite coatings
subject keywordsn electroless coatings
subject keywordsn electroless depo
identifier doi10.1109/ECTC.2014.6897466
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize389116
citations0


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