Visualization of slurry flow in polishing pad asperity area
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/ECTC.2014.6897436
کلیدواژه(گان): bonding processes,n fine-pitch technology,n metallisation,n accelerated SLID bonding,n fine pitch interconnections,n fine pitch off chip interconnections,n residual solders,n solder caps,n solder intermetallic interfaces,n thin multilayer copper solder stack,n ultra short off chip interconnections,n Assembly,n Bonding,n Copper,n Intermetallic,n Joints,n Reliability,n Tin
کالکشن
:
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آمار بازدید
Visualization of slurry flow in polishing pad asperity area
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| contributor author | Fukuda, A. | |
| contributor author | Mitarai, M. | |
| date accessioned | 2020-03-12T22:38:00Z | |
| date available | 2020-03-12T22:38:00Z | |
| date issued | 2014 | |
| identifier other | 7017288.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089393 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Visualization of slurry flow in polishing pad asperity area | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227599 | |
| subject keywords | bonding processes | |
| subject keywords | n fine-pitch technology | |
| subject keywords | n metallisation | |
| subject keywords | n accelerated SLID bonding | |
| subject keywords | n fine pitch interconnections | |
| subject keywords | n fine pitch off chip interconnections | |
| subject keywords | n residual solders | |
| subject keywords | n solder caps | |
| subject keywords | n solder intermetallic interfaces | |
| subject keywords | n thin multilayer copper solder stack | |
| subject keywords | n ultra short off chip interconnections | |
| subject keywords | n Assembly | |
| subject keywords | n Bonding | |
| subject keywords | n Copper | |
| subject keywords | n Intermetallic | |
| subject keywords | n Joints | |
| subject keywords | n Reliability | |
| subject keywords | n Tin | |
| identifier doi | 10.1109/ECTC.2014.6897436 | |
| journal title | lanarization/CMP Technology (ICPT), 2014 International Conference on | |
| filesize | 137826 | |
| citations | 0 |