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Visualization of slurry flow in polishing pad asperity area

Author:
Fukuda, A.
,
Mitarai, M.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ECTC.2014.6897436
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1089393
Keyword(s): bonding processes,n fine-pitch technology,n metallisation,n accelerated SLID bonding,n fine pitch interconnections,n fine pitch off chip interconnections,n residual solders,n solder caps,n solder intermetallic interfaces,n thin multilayer copper solder stack,n ultra short off chip interconnections,n Assembly,n Bonding,n Copper,n Intermetallic,n Joints,n Reliability,n Tin
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    Visualization of slurry flow in polishing pad asperity area

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contributor authorFukuda, A.
contributor authorMitarai, M.
date accessioned2020-03-12T22:38:00Z
date available2020-03-12T22:38:00Z
date issued2014
identifier other7017288.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089393
formatgeneral
languageEnglish
publisherIEEE
titleVisualization of slurry flow in polishing pad asperity area
typeConference Paper
contenttypeMetadata Only
identifier padid8227599
subject keywordsbonding processes
subject keywordsn fine-pitch technology
subject keywordsn metallisation
subject keywordsn accelerated SLID bonding
subject keywordsn fine pitch interconnections
subject keywordsn fine pitch off chip interconnections
subject keywordsn residual solders
subject keywordsn solder caps
subject keywordsn solder intermetallic interfaces
subject keywordsn thin multilayer copper solder stack
subject keywordsn ultra short off chip interconnections
subject keywordsn Assembly
subject keywordsn Bonding
subject keywordsn Copper
subject keywordsn Intermetallic
subject keywordsn Joints
subject keywordsn Reliability
subject keywordsn Tin
identifier doi10.1109/ECTC.2014.6897436
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize137826
citations0
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