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About the application of CMP for Monolithic integration of photonic components in a 0.25 μm BiCMOS process

contributor authorTrusch, A.
contributor authorLisker, M.
contributor authorYamamoto, Y.
contributor authorKruger, A.
contributor authorLischke, S.
contributor authorKnoll, D.
contributor authorTillack, B.
date accessioned2020-03-12T22:37:59Z
date available2020-03-12T22:37:59Z
date issued2014
identifier other7017277.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089381?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleAbout the application of CMP for Monolithic integration of photonic components in a 0.25 μm BiCMOS process
typeConference Paper
contenttypeMetadata Only
identifier padid8227586
subject keywordsSPICE
subject keywordsn finite difference time-domain analysis
subject keywordsn graphene
subject keywordsn integrated circuit interconnections
subject keywordsn nanoribbons
subject keywordsn FDTD method
subject keywordsn HSPICE simulations
subject keywordsn MLGNR interconnects
subject keywordsn crosstalk analysis
subject keywordsn crosstalk effects modeling
subject keywordsn finite-difference time-domain technique
subject keywordsn multilayer graphene nanoribbon interconnects
subject keywordsn Computational modeling
subject keywordsn Crosstalk
subject keywordsn Finite difference methods
subject keywordsn Inductance
subject keywordsn Propagation delay
subject keywordsn Quantum capacitance
identifier doi10.1109/ECTC.2014.6897425
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize309749
citations0


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