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CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad

contributor authorKimura, K.
contributor authorChen, C.-C.A.
date accessioned2020-03-12T22:37:55Z
date available2020-03-12T22:37:55Z
date issued2014
identifier other7017251.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089352?show=full
formatgeneral
languageEnglish
publisherIEEE
titleCMP process — Integrated chemical & physical phenomena in between wafer and polishing pad
typeConference Paper
contenttypeMetadata Only
identifier padid8227554
subject keywordsoptimisation
subject keywordsn reliability
subject keywordsn surface mount technology
subject keywordsn wafer level packaging
subject keywordsn SMT process optimization
subject keywordsn board level reliability
subject keywordsn board level temperature cycle
subject keywordsn pitch wafer level packages
subject keywordsn stencil aperture ratios
subject keywordsn surface mount assembly
subject keywordsn temperature cycling reliability
subject keywordsn test vehicles
subject keywordsn Assembly
subject keywordsn Electric shock
subject keywordsn Passivation
subject keywordsn Semiconductor device reliability
subject keywordsn Temperature measurement
subject keywordsn Vehicles
identifier doi10.1109/ECTC.2014.6897398
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize932833
citations0


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