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Equalization-based enterprise service selection

contributor authorXue Xiao
contributor authorWang Shufang
date accessioned2020-03-12T22:37:44Z
date available2020-03-12T22:37:44Z
date issued2014
identifier other7017167.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089254?show=full
formatgeneral
languageEnglish
publisherIEEE
titleEqualization-based enterprise service selection
typeConference Paper
contenttypeMetadata Only
identifier padid8227435
subject keywordsX-ray diffraction
subject keywordsn ageing
subject keywordsn ball grid arrays
subject keywordsn creep
subject keywordsn elasticity
subject keywordsn failure analysis
subject keywordsn nanoindentation
subject keywordsn plasticity
subject keywordsn printed circuits
subject keywordsn reliability
subject keywordsn solders
subject keywordsn stress effects
subject keywordsn PBGA assembly
subject keywordsn SAC lead free solder joint
subject keywordsn SAC105 test board
subject keywordsn SAC205 test board
subject keywordsn SAC305 test board
subject keywordsn SAC405 test board
subject keywordsn X-ray microdiffraction technique
subject keywordsn aging induced solder joint evolution
subject keywordsn creep behavior
subject keywordsn grain boundary sliding creep mechanism
identifier doi10.1109/ECTC.2014.6897315
journal titleomputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE
filesize288820
citations0


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