Software Defined Open Architecture Modem development at CMRE
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, , , , , , ,Publisher:
Year
: 2014DOI: 10.1109/ECTC.2014.6897306
Keyword(s): CMOS integrated circuits,n accelerometers,n aluminium,n chromium,n gold,n hermetic seals,n integrated circuit bonding,n integrated circuit packaging,n micromachining,n micromechanical devices,n silicon,n silicon-on-insulator,n three-dimensional integrated circuits,n 3D CMOS-on-MEMS stacking,n Al,n Au,n CMOS metal layer,n CMOS readout circuit,n Cr,n DRIE,n J-leaded ceramic package,n MEMS chip metallization,n MEMS metal layer,n M
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Software Defined Open Architecture Modem development at CMRE
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| contributor author | Potter, J. | |
| contributor author | Alves, J. | |
| contributor author | Furfaro, T. | |
| contributor author | Vermeij, A. | |
| contributor author | Jourden, N. | |
| contributor author | Zappa, G. | |
| contributor author | Berni, A. | |
| contributor author | Merani, D. | |
| date accessioned | 2020-03-12T22:37:42Z | |
| date available | 2020-03-12T22:37:42Z | |
| date issued | 2014 | |
| identifier other | 7017157.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089243 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Software Defined Open Architecture Modem development at CMRE | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227422 | |
| subject keywords | CMOS integrated circuits | |
| subject keywords | n accelerometers | |
| subject keywords | n aluminium | |
| subject keywords | n chromium | |
| subject keywords | n gold | |
| subject keywords | n hermetic seals | |
| subject keywords | n integrated circuit bonding | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n micromachining | |
| subject keywords | n micromechanical devices | |
| subject keywords | n silicon | |
| subject keywords | n silicon-on-insulator | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D CMOS-on-MEMS stacking | |
| subject keywords | n Al | |
| subject keywords | n Au | |
| subject keywords | n CMOS metal layer | |
| subject keywords | n CMOS readout circuit | |
| subject keywords | n Cr | |
| subject keywords | n DRIE | |
| subject keywords | n J-leaded ceramic package | |
| subject keywords | n MEMS chip metallization | |
| subject keywords | n MEMS metal layer | |
| subject keywords | n M | |
| identifier doi | 10.1109/ECTC.2014.6897306 | |
| journal title | nderwater Communications and Networking (UComms), 2014 | |
| filesize | 211022 | |
| citations | 0 |