Can social networking improve project management? An exploratory study of UK professional experience
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سال
: 2014شناسه الکترونیک: 10.1109/ISSE.2014.6887626
کلیدواژه(گان): conductive adhesives,n heat sinks,n integrated circuit packaging,n mechanical strength,n nanostructured materials,n silver alloys,n sintering,n thermal resistance,n Ag,n TIMs,n heat sink,n heat source,n integrated circuits,n joints mechanical strength,n microelectronic packaging,n nano-silver paste sintering phenomena,n silicon chip fixing,n thermal interface materials,n thermal properties,n thermal resistance,n thermally conductive adh
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Can social networking improve project management? An exploratory study of UK professional experience
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| contributor author | Furnell, R. | |
| contributor author | Scott, P. | |
| date accessioned | 2020-03-12T22:26:15Z | |
| date available | 2020-03-12T22:26:15Z | |
| date issued | 2014 | |
| identifier other | 7009031.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1082992 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Can social networking improve project management? An exploratory study of UK professional experience | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8219635 | |
| subject keywords | conductive adhesives | |
| subject keywords | n heat sinks | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n mechanical strength | |
| subject keywords | n nanostructured materials | |
| subject keywords | n silver alloys | |
| subject keywords | n sintering | |
| subject keywords | n thermal resistance | |
| subject keywords | n Ag | |
| subject keywords | n TIMs | |
| subject keywords | n heat sink | |
| subject keywords | n heat source | |
| subject keywords | n integrated circuits | |
| subject keywords | n joints mechanical strength | |
| subject keywords | n microelectronic packaging | |
| subject keywords | n nano-silver paste sintering phenomena | |
| subject keywords | n silicon chip fixing | |
| subject keywords | n thermal interface materials | |
| subject keywords | n thermal properties | |
| subject keywords | n thermal resistance | |
| subject keywords | n thermally conductive adh | |
| identifier doi | 10.1109/ISSE.2014.6887626 | |
| journal title | nformation Society (i-Society), 2014 International Conference on | |
| filesize | 233681 | |
| citations | 0 |