contributor author | Ortega-Zamorano, Francisco | |
contributor author | Jerez, Jose M. | |
contributor author | Juarez, Gustavo | |
contributor author | Perez, Jorge O. | |
contributor author | Franco, Leonardo | |
date accessioned | 2020-03-12T22:26:10Z | |
date available | 2020-03-12T22:26:10Z | |
date issued | 2014 | |
identifier other | 7008986.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1082946?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | High precision FPGA implementation of neural network activation functions | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8219584 | |
subject keywords | bismuth alloys | |
subject keywords | n copper alloys | |
subject keywords | n printed circuits | |
subject keywords | n reflow soldering | |
subject keywords | n shear strength | |
subject keywords | n tin alloys | |
subject keywords | n BiSnAg | |
subject keywords | n Cu< | |
subject keywords | sub> | |
subject keywords | 6< | |
subject keywords | /sub> | |
subject keywords | Sn< | |
subject keywords | sub> | |
subject keywords | 5< | |
subject keywords | /sub> | |
subject keywords | n IMC | |
subject keywords | n PCB | |
subject keywords | n SnBi-Cu | |
subject keywords | n chip resistors | |
subject keywords | n confocal laser scanning microscope | |
subject keywords | n intermetallic compound | |
subject keywords | n mechanical strength | |
subject keywords | n printed circuit boards | |
subject keywords | n reflow soldering profiles | |
subject keywords | n shear strength test | |
subject keywords | n solder pads | |
subject keywords | n Heating | |
subject keywords | n Intermetallic | |
subject keywords | n Joints | |
subject keywords | n Soldering | |
subject keywords | n Tempera | |
identifier doi | 10.1109/ISSE.2014.6887582 | |
journal title | ntelligent Embedded Systems (IES), 2014 IEEE Symposium on | |
filesize | 1417329 | |
citations | 0 | |