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Tracking micro reentering USV with multi-sensors using fusion CKF algorithm

contributor authorHuang, P.
contributor authorQian, S.
contributor authorLi, H.N.
date accessioned2020-03-12T22:24:05Z
date available2020-03-12T22:24:05Z
date issued2014
identifier other7007383.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1081746?show=full
formatgeneral
languageEnglish
publisherIEEE
titleTracking micro reentering USV with multi-sensors using fusion CKF algorithm
typeConference Paper
contenttypeMetadata Only
identifier padid8218269
subject keywordscryogenic electronics
subject keywordsn lead bonding
subject keywordsn micromechanical devices
subject keywordsn stress effects
subject keywordsn three-dimensional integrated circuits
subject keywordsn wafer bonding
subject keywordsn 3D-IC
subject keywordsn MEMS
subject keywordsn fragile dielectric layers
subject keywordsn heterogeneous integration
subject keywordsn low-temperature bonding technologies
subject keywordsn sensitive mechanical structures
subject keywordsn stress-induced failures
subject keywordsn temperature-sensitive materials
subject keywordsn thinned wafers
subject keywordsn transistor stress sensitivity
subject keywordsn Bonding
subject keywordsn Materials
subject keywordsn Micromechanical devices
subject keywordsn Plas
identifier doi10.1109/LTB-3D.2014.6886173
journal titleuidance, Navigation and Control Conference (CGNCC), 2014 IEEE Chinese
filesize170109
citations0


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