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Numerical Study of Overheat Fault in Copper Wire Caused by Bad Contact Base on Multi-physics Coupling

contributor authorYang, Wen-Bing
contributor authorMo, Shan-Jun
contributor authorLianga, Dong
contributor authorZhen, Fang-Jie
date accessioned2020-03-12T22:20:07Z
date available2020-03-12T22:20:07Z
date issued2014
identifier other7003566.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1079444?show=full
formatgeneral
languageEnglish
publisherIEEE
titleNumerical Study of Overheat Fault in Copper Wire Caused by Bad Contact Base on Multi-physics Coupling
typeConference Paper
contenttypeMetadata Only
identifier padid8215790
subject keywordscompressed sensing
subject keywordsn image reconstruction
subject keywordsn multipath channels
subject keywordsn radar imaging
subject keywordsn radar target recognition
subject keywordsn CS
subject keywordsn TWRI
subject keywordsn clutter-free images
subject keywordsn compressive sensing
subject keywordsn electromagnetic wave propagation
subject keywordsn indirect signal propagation paths
subject keywordsn indoor scenes
subject keywordsn interior walls
subject keywordsn joint scene reconstruction
subject keywordsn multipath exploitation schemes
subject keywordsn obscured targets
subject keywordsn position estimation approach
subject keywordsn specular multipath exploitation
subject keywordsn through-the-wall radar images
identifier doi10.1109/SAM.2014.6882447
journal titlentelligent Computation Technology and Automation (ICICTA), 2014 7th International Conference on
filesize474878
citations0


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