[Copyright notice]
| date accessioned | 2020-03-12T22:10:02Z | |
| date available | 2020-03-12T22:10:02Z | |
| date issued | 2014 | |
| identifier other | 6996303.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1073787?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | [Copyright notice] | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8209912 | |
| subject keywords | CMOS integrated circuits | |
| subject keywords | n readout electronics | |
| subject keywords | n thin film circuits | |
| subject keywords | n thin film sensors | |
| subject keywords | n thin film transistors | |
| subject keywords | n transistor circuits | |
| subject keywords | n CMOS ICs | |
| subject keywords | n LAE scalability | |
| subject keywords | n LAE sensors | |
| subject keywords | n TFT based scanning circuit | |
| subject keywords | n capacitive coupling | |
| subject keywords | n capacitively-coupled control signals | |
| subject keywords | n energy efficiency | |
| subject keywords | n hybrid systems | |
| subject keywords | n inductive coupling | |
| subject keywords | n interconnects | |
| subject keywords | n large-area electronics | |
| subject keywords | n large-scale systems | |
| subject keywords | n low power consumption | |
| subject keywords | n metallurgical bonding | |
| subject keywords | n mi | |
| identifier doi | 10.1109/DRC.2014.6872402 | |
| journal title | ntennas and Propagation Conference (LAPC), 2014 Loughborough | |
| filesize | 32605 | |
| citations | 0 |
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