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Electronic board modeling by the means of DELPHI compact thermal model of components

contributor authorMonier-Vinard, Eric
contributor authorBissuel, Valentin
contributor authorDia, Cheikh Tidiane
contributor authorDaniel, Olivier
contributor authorLaraqi, Najib
date accessioned2020-03-12T22:02:13Z
date available2020-03-12T22:02:13Z
date issued2014
identifier other6972491.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1069184?show=full
formatgeneral
languageEnglish
publisherIEEE
titleElectronic board modeling by the means of DELPHI compact thermal model of components
typeConference Paper
contenttypeMetadata Only
identifier padid8204451
subject keywordseddy current losses
subject keywordsn finite element analysis
subject keywordsn genetic algorithms
subject keywordsn permanent magnet machines
subject keywordsn stators
subject keywordsn synchronous machines
subject keywordsn 2D finite element method
subject keywordsn concentrated windings
subject keywordsn distributed windings
subject keywordsn eddy current loss reduction
subject keywordsn genetic algorithm
subject keywordsn optimization process
subject keywordsn stator slot shape optimization
subject keywordsn surface mounted permanent magnet synchronous machine
subject keywordsn Eddy currents
subject keywordsn Magnetic losses
subject keywordsn Optimization
subject keywordsn Shape
subject keywordsn Stator windings
subject keywordsn Win
identifier doi10.1109/EVER.2014.6844156
journal titlehermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
filesize2627066
citations0


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