A comparison of methods for the vehicle routing problem
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Year
: 2014DOI: 10.1109/IITC.2014.6831888
Keyword(s): annealing,n copper,n electric resistance,n electromigration,n grain growth,n grain size,n integrated circuit interconnections,n low-k dielectric thin films,n passivation,n stress control,n tantalum compounds,n thermal stresses,n Cu,n TaN,n anneal temperature,n copper interconnects,n electromigration resistance,n grain growth,n grain size,n low-k dielectric,n metal passivation layer,n stress voiding related problems,n temperature 1
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A comparison of methods for the vehicle routing problem
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| contributor author | Pinninghoff, M.A. | |
| contributor author | Contreras, R. | |
| contributor author | Pantoja, C. | |
| date accessioned | 2020-03-12T21:54:55Z | |
| date available | 2020-03-12T21:54:55Z | |
| date issued | 2014 | |
| identifier other | 6965167.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1064959 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | A comparison of methods for the vehicle routing problem | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8198169 | |
| subject keywords | annealing | |
| subject keywords | n copper | |
| subject keywords | n electric resistance | |
| subject keywords | n electromigration | |
| subject keywords | n grain growth | |
| subject keywords | n grain size | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n low-k dielectric thin films | |
| subject keywords | n passivation | |
| subject keywords | n stress control | |
| subject keywords | n tantalum compounds | |
| subject keywords | n thermal stresses | |
| subject keywords | n Cu | |
| subject keywords | n TaN | |
| subject keywords | n anneal temperature | |
| subject keywords | n copper interconnects | |
| subject keywords | n electromigration resistance | |
| subject keywords | n grain growth | |
| subject keywords | n grain size | |
| subject keywords | n low-k dielectric | |
| subject keywords | n metal passivation layer | |
| subject keywords | n stress voiding related problems | |
| subject keywords | n temperature 1 | |
| identifier doi | 10.1109/IITC.2014.6831888 | |
| journal title | omputing Conference (CLEI), 2014 XL Latin American | |
| filesize | 479828 | |
| citations | 0 |