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contributor authorRosato, F.
contributor authorArguello, J.
contributor authorCardinale, Y.
date accessioned2020-03-12T21:54:52Z
date available2020-03-12T21:54:52Z
date issued2014
identifier other6965137.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1064928?show=full
formatgeneral
languageEnglish
publisherIEEE
titleOPTIMUS: OPTImized Mail distribUtion System
typeConference Paper
contenttypeMetadata Only
identifier padid8198124
subject keywordscopper
subject keywordsn electromigration
subject keywordsn integrated circuit interconnections
subject keywordsn integrated circuit reliability
subject keywordsn vias
subject keywordsn voids (solid)
subject keywordsn Cu
subject keywordsn copper interconnect
subject keywordsn electromigration process
subject keywordsn interconnects reliability
subject keywordsn lifetime prediction
subject keywordsn local sense structure
subject keywordsn small resistance measurement
subject keywordsn standard single via structure
subject keywordsn void formation
subject keywordsn void nucleation
subject keywordsn Electrical resistance measurement
subject keywordsn Electromigration
subject keywordsn Periodic structures
subject keywordsn Reliability
subject keywordsn R
identifier doi10.1109/IITC.2014.6831858
journal titleomputing Conference (CLEI), 2014 XL Latin American
filesize406411
citations0


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