contributor author | Rosato, F. | |
contributor author | Arguello, J. | |
contributor author | Cardinale, Y. | |
date accessioned | 2020-03-12T21:54:52Z | |
date available | 2020-03-12T21:54:52Z | |
date issued | 2014 | |
identifier other | 6965137.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1064928?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | OPTIMUS: OPTImized Mail distribUtion System | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8198124 | |
subject keywords | copper | |
subject keywords | n electromigration | |
subject keywords | n integrated circuit interconnections | |
subject keywords | n integrated circuit reliability | |
subject keywords | n vias | |
subject keywords | n voids (solid) | |
subject keywords | n Cu | |
subject keywords | n copper interconnect | |
subject keywords | n electromigration process | |
subject keywords | n interconnects reliability | |
subject keywords | n lifetime prediction | |
subject keywords | n local sense structure | |
subject keywords | n small resistance measurement | |
subject keywords | n standard single via structure | |
subject keywords | n void formation | |
subject keywords | n void nucleation | |
subject keywords | n Electrical resistance measurement | |
subject keywords | n Electromigration | |
subject keywords | n Periodic structures | |
subject keywords | n Reliability | |
subject keywords | n R | |
identifier doi | 10.1109/IITC.2014.6831858 | |
journal title | omputing Conference (CLEI), 2014 XL Latin American | |
filesize | 406411 | |
citations | 0 | |