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Universal high-temperature suitable joint adapting diffusion soldering

contributor authorStrogies, Joerg
contributor authorWilke, Klaus
date accessioned2020-03-12T21:52:45Z
date available2020-03-12T21:52:45Z
date issued2014
identifier other6962861.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063719?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleUniversal high-temperature suitable joint adapting diffusion soldering
typeConference Paper
contenttypeMetadata Only
identifier padid8196129
subject keywordsWeb services
subject keywordsn XML
subject keywordsn data handling
subject keywordsn file organisation
subject keywordsn service-oriented architecture
subject keywordsn DIME
subject keywordsn Internet
subject keywordsn MTOM mechanism
subject keywordsn SOAP envelope
subject keywordsn Web services
subject keywordsn XML Infoset
subject keywordsn XML message
subject keywordsn binary data
subject keywordsn chunk size
subject keywordsn direct internet message encapsulation
subject keywordsn encryption techniques
subject keywordsn extensible markup language
subject keywordsn file transfer
subject keywordsn message transmission optimization mechanism
subject keywordsn threads
subject keywordsn Computer architecture
subject keywordsn Message systems
subject keywordsn Optimization
identifier doi10.1109/IndiaCom.2014.6828154
journal titlelectronics System-Integration Technology Conference (ESTC), 2014
filesize3832855
citations0


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