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Development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices

contributor authorGoldberg, Adrian
contributor authorIhle, Martin
contributor authorZiesche, Steffen
contributor authorKulls, Robert
date accessioned2020-03-12T21:52:30Z
date available2020-03-12T21:52:30Z
date issued2014
identifier other6962720.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063577?show=full
formatgeneral
languageEnglish
publisherIEEE
titleDevelopment of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices
typeConference Paper
contenttypeMetadata Only
identifier padid8195932
subject keywordsJava
subject keywordsn bar charts
subject keywordsn computer aided instruction
subject keywordsn computer science education
subject keywordsn operating systems (computers)
subject keywordsn CPU scheduling algorithm learning
subject keywordsn CS students
subject keywordsn Gantt Charts
subject keywordsn Java Swing
subject keywordsn average waiting time
subject keywordsn computer science education
subject keywordsn learning operating system
subject keywordsn runtime details
subject keywordsn turnaround time
subject keywordsn visual tool
subject keywordsn Decision support systems
subject keywordsn Education
subject keywordsn Handheld computers
subject keywordsn Java
subject keywordsn Operating systems
subject keywordsn Scheduling algorithms
subject keywordsn Visualiz
identifier doi10.1109/IndiaCom.2014.6828013
journal titlelectronics System-Integration Technology Conference (ESTC), 2014
filesize1415121
citations0


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