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contributor authorHoque, K.A.
contributor authorMohamed, O.A.
contributor authorSavaria, Y.
contributor authorThibeault, C.
date accessioned2020-03-12T21:51:41Z
date available2020-03-12T21:51:41Z
date issued2014
identifier other6961856.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063108?show=full
formatgeneral
languageEnglish
publisherIEEE
titleProbabilistic model checking based DAL analysis to optimize a combined TMR-blind-scrubbing mitigation technique for FPGA-based aerospace applications
typeConference Paper
contenttypeMetadata Only
identifier padid8195198
subject keywordsassembling
subject keywordsn moulding
subject keywordsn three-dimensional integrated circuits
subject keywordsn wafer level packaging
subject keywordsn 3D IC assembly process
subject keywordsn CoW technology
subject keywordsn SMC
subject keywordsn WLP
subject keywordsn chip thickness
subject keywordsn chip-on-wafer technology
subject keywordsn sheet-type molding compound
subject keywordsn three-dimensional integrated circuit technology
subject keywordsn ultra-thin chip stacking technology
subject keywordsn wafer-level-packaging
subject keywordsn Assembly
subject keywordsn Bonding
subject keywordsn Semiconductor device measurement
subject keywordsn Silicon
subject keywordsn Strain
subject keywordsn Through-silicon vias
subject keywordsn chip-on-wafer
identifier doi10.1109/ICEP.2014.6826723
journal titleormal Methods and Models for Codesign (MEMOCODE), 2014 Twelfth ACM/IEEE International Conference on
filesize528274
citations0


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