Link-Layer Throughput of FHSS with Interference Mitigation: Analysis and Cross Layer Design
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سال
: 2014شناسه الکترونیک: 10.1109/EuroSimE.2014.6813865
کلیدواژه(گان): BiCMOS integrated circuits,n SPICE,n Schottky diodes,n doping profiles,n finite element analysis,n integrated circuit manufacture,n lighting,n low-power electronics,n power conversion,n rectifying circuits,n solid-state rectifiers,n COMSOL Multiphysics environment,n SPICE model parameter,n Schottky diode design,n Schottky diode fabrication,n Schottky diode modelling,n TSUPREME4,n circuit analysis,n doping profile,n junction depth,n low
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آمار بازدید
Link-Layer Throughput of FHSS with Interference Mitigation: Analysis and Cross Layer Design
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| contributor author | Adeladan, Oluwatosin A. | |
| contributor author | Shea, John M. | |
| date accessioned | 2020-03-12T21:45:14Z | |
| date available | 2020-03-12T21:45:14Z | |
| date issued | 2014 | |
| identifier other | 6956875.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1059219 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Link-Layer Throughput of FHSS with Interference Mitigation: Analysis and Cross Layer Design | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8190749 | |
| subject keywords | BiCMOS integrated circuits | |
| subject keywords | n SPICE | |
| subject keywords | n Schottky diodes | |
| subject keywords | n doping profiles | |
| subject keywords | n finite element analysis | |
| subject keywords | n integrated circuit manufacture | |
| subject keywords | n lighting | |
| subject keywords | n low-power electronics | |
| subject keywords | n power conversion | |
| subject keywords | n rectifying circuits | |
| subject keywords | n solid-state rectifiers | |
| subject keywords | n COMSOL Multiphysics environment | |
| subject keywords | n SPICE model parameter | |
| subject keywords | n Schottky diode design | |
| subject keywords | n Schottky diode fabrication | |
| subject keywords | n Schottky diode modelling | |
| subject keywords | n TSUPREME4 | |
| subject keywords | n circuit analysis | |
| subject keywords | n doping profile | |
| subject keywords | n junction depth | |
| subject keywords | n low | |
| identifier doi | 10.1109/EuroSimE.2014.6813865 | |
| journal title | ilitary Communications Conference (MILCOM), 2014 IEEE | |
| filesize | 254126 | |
| citations | 0 |