Comparison of static and dynamic calculations of short circuit currents in distributed generation networks
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سال
: 2014شناسه الکترونیک: 10.1109/ICEPT.2014.6922809
کلیدواژه(گان): ball grid arrays,convection,numerical analysis,stress-strain relations,thermal stresses,3D-BGA packaging model,cover shell,heat convection coefficients,numerical simulation method,packaging materials,reliable packaging structure,strain field,structural design,sub-center ball,thermal stress field distribution,Electronic packaging thermal management,Heating,Materials,Packaging,Solid modeling,Stress,Thermal stresses,BGA packaging,numerical simulation,thermal field,thermal s
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آمار بازدید
Comparison of static and dynamic calculations of short circuit currents in distributed generation networks
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| contributor author | Kontis, E.O. | |
| contributor author | Dimos, K.S. | |
| contributor author | Papadopoulos, T.A. | |
| contributor author | Papadopoulos, P.N. | |
| contributor author | Papagiannis, G.K. | |
| date accessioned | 2020-03-12T21:19:58Z | |
| date available | 2020-03-12T21:19:58Z | |
| date issued | 2014 | |
| identifier other | 6934676.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1045169 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Comparison of static and dynamic calculations of short circuit currents in distributed generation networks | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8173668 | |
| subject keywords | ball grid arrays | |
| subject keywords | convection | |
| subject keywords | numerical analysis | |
| subject keywords | stress-strain relations | |
| subject keywords | thermal stresses | |
| subject keywords | 3D-BGA packaging model | |
| subject keywords | cover shell | |
| subject keywords | heat convection coefficients | |
| subject keywords | numerical simulation method | |
| subject keywords | packaging materials | |
| subject keywords | reliable packaging structure | |
| subject keywords | strain field | |
| subject keywords | structural design | |
| subject keywords | sub-center ball | |
| subject keywords | thermal stress field distribution | |
| subject keywords | Electronic packaging thermal management | |
| subject keywords | Heating | |
| subject keywords | Materials | |
| subject keywords | Packaging | |
| subject keywords | Solid modeling | |
| subject keywords | Stress | |
| subject keywords | Thermal stresses | |
| subject keywords | BGA packaging | |
| subject keywords | numerical simulation | |
| subject keywords | thermal field | |
| subject keywords | thermal s | |
| identifier doi | 10.1109/ICEPT.2014.6922809 | |
| journal title | ower Engineering Conference (UPEC), 2014 49th International Universities | |
| filesize | 316699 | |
| citations | 0 |