3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity
نویسنده:
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سال
: 2014شناسه الکترونیک: 10.1109/MED.2014.6961484
کلیدواژه(گان): Buildings,Heating,Matrix decomposition,Principal component analysis,Temperature sensors,Valves
کالکشن
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آمار بازدید
3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity
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| contributor author | Wang, L. | |
| contributor author | Brown, A.R. | |
| contributor author | Nedjalkov, M. | |
| contributor author | Alexander, C. | |
| contributor author | Cheng, B. | |
| contributor author | Millar, C. | |
| contributor author | Asenov, A. | |
| date accessioned | 2020-03-12T21:15:34Z | |
| date available | 2020-03-12T21:15:34Z | |
| date issued | 2014 | |
| identifier other | 6931615.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1042573?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | 3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8170303 | |
| subject keywords | Buildings | |
| subject keywords | Heating | |
| subject keywords | Matrix decomposition | |
| subject keywords | Principal component analysis | |
| subject keywords | Temperature sensors | |
| subject keywords | Valves | |
| identifier doi | 10.1109/MED.2014.6961484 | |
| journal title | imulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on | |
| filesize | 1114515 | |
| citations | 0 |