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Compact thermal model of double-layer microchannel heat sink with high temperature uniformity for multiple LEDs

contributor authorYongming Zhu
contributor authorRun Hu
contributor authorJinyan Hu
contributor authorXiaobing Luo
date accessioned2020-03-12T21:03:45Z
date available2020-03-12T21:03:45Z
date issued2014
identifier other6922929.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1035622?show=full
formatgeneral
languageEnglish
publisherIEEE
titleCompact thermal model of double-layer microchannel heat sink with high temperature uniformity for multiple LEDs
typeConference Paper
contenttypeMetadata Only
identifier padid8161705
subject keywordsflow shop scheduling
subject keywordsgenetic algorithms
subject keywordsminimisation
subject keywords010 crossover
subject keywords101 crossover
subject keywordsadjacent exchange mutation
subject keywordscrossover operators
subject keywordscycle crossover
subject keywordsgenetic algorithm
subject keywordsheuristic rules
subject keywordsmakespan minimization
subject keywordsmutation operators
subject keywordspermutation flowshop scheduling problems
subject keywordsshift mutation
subject keywordsAlgorithm design and analysis
subject keywordsGenetic algorithms
subject keywordsGenetics
subject keywordsHeuristic algorithms
subject keywordsJob shop scheduling
subject keywordsSociology
subject keywordsStatistics
subject keywordsFlowshop problems
subject keywordsgenetic algorithm
subject keywordsmakespan
subject keywordsoperator combination
identifier doi10.1109/ICInfA.2014.6932627
journal titlelectronic Packaging Technology (ICEPT), 2014 15th International Conference on
filesize1064271
citations0


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