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Modeling of the coelescence of micro-voids under the influence of elastic stresses and electromigration

contributor authorPeng Zhou
contributor authorJie Wang
date accessioned2020-03-12T21:03:34Z
date available2020-03-12T21:03:34Z
date issued2014
identifier other6922825.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1035518?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleModeling of the coelescence of micro-voids under the influence of elastic stresses and electromigration
typeConference Paper
contenttypeMetadata Only
identifier padid8161585
subject keywordsCeramics
subject keywordsElectric potential
subject keywordsElectrodes
subject keywordsEnergy harvesting
subject keywordsPiezoelectric transducers
subject keywordsPZT ceramics
subject keywordsenergy harvesting
subject keywordsenergy management
subject keywordsenergy storage
subject keywordsnumerical simulation
subject keywordspiezoelectric transducers
identifier doi10.1109/ICEPE.2014.6969989
journal titlelectronic Packaging Technology (ICEPT), 2014 15th International Conference on
filesize365749
citations0


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