Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature
| contributor author | Xue Du | |
| contributor author | Yanhong Tian | |
| contributor author | Xin Zhao | |
| date accessioned | 2020-03-12T21:03:31Z | |
| date available | 2020-03-12T21:03:31Z | |
| date issued | 2014 | |
| identifier other | 6922791.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1035485?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8161547 | |
| subject keywords | Aircraft | |
| subject keywords | Fault trees | |
| subject keywords | Hazards | |
| subject keywords | Maintenance engineering | |
| subject keywords | Monitoring | |
| subject keywords | Software | |
| subject keywords | aircraft avionics | |
| subject keywords | aircraft certification | |
| subject keywords | fault trees | |
| subject keywords | flight control system | |
| subject keywords | hazard analysis | |
| subject keywords | health monitoring | |
| subject keywords | system safety | |
| identifier doi | 10.1109/MMAR.2014.6957430 | |
| journal title | lectronic Packaging Technology (ICEPT), 2014 15th International Conference on | |
| filesize | 573790 | |
| citations | 0 |
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