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Preparation of raspberry-like SiO<inf>2</inf> nanoparticles and thermo-mechanical properties of its epoxy composites

contributor authorLiang Huang
contributor authorGang Li
contributor authorPengli Zhu
contributor authorRong Sun
contributor authorDaoqiang Lu
contributor authorChingping Wong
date accessioned2020-03-12T21:03:17Z
date available2020-03-12T21:03:17Z
date issued2014
identifier other6922650.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1035345?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titlePreparation of raspberry-like SiO<inf>2</inf> nanoparticles and thermo-mechanical properties of its epoxy composites
typeConference Paper
contenttypeMetadata Only
identifier padid8161381
subject keywordscomputer aided instruction
subject keywordsgraphical user interfaces
subject keywordshuman computer interaction
subject keywordsvirtual instrumentation
subject keywordsUniversity Physics Virtual Experiment
subject keywordsaffordance design
subject keywordsaffordance model
subject keywordscognitive affordance
subject keywordsdesk-top virtual experiments
subject keywordsfunctional affordance
subject keywordsperceptual affordance
subject keywordsphysical affordance
subject keywordsvirtual learning environments
subject keywordsvisual interface design
subject keywordsCognition
subject keywordsColor
subject keywordsEducational institutions
subject keywordsLearning systems
subject keywordsNavigation
subject keywordsPhysics
subject keywordsVisualization
subject keywordsaffordance
subject keywordsvirtual experiments
subject keywordsvisual int
identifier doi10.1109/InfoSEEE.2014.6948192
journal titlelectronic Packaging Technology (ICEPT), 2014 15th International Conference on
filesize802515
citations0


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