Analysis on electromagnetic isolation issues among multi-chips in system in package
| contributor author | Peng Wu | |
| contributor author | Fengman Liu | |
| contributor author | Yi He | |
| contributor author | Huimin He | |
| contributor author | Jun Li | |
| contributor author | Liqiang Cao | |
| contributor author | Dongkai Shangguan | |
| contributor author | Lixi Wan | |
| date accessioned | 2020-03-12T21:03:13Z | |
| date available | 2020-03-12T21:03:13Z | |
| date issued | 2014 | |
| identifier other | 6922585.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1035299?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Analysis on electromagnetic isolation issues among multi-chips in system in package | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8161330 | |
| subject keywords | Conferences | |
| subject keywords | Semiconductor lasers | |
| identifier doi | 10.1109/ISLC.2014.165 | |
| journal title | lectronic Packaging Technology (ICEPT), 2014 15th International Conference on | |
| filesize | 666289 | |
| citations | 0 |
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