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Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting

date accessioned2020-03-12T20:52:49Z
date available2020-03-12T20:52:49Z
date issued2014
identifier other6910965.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1028878?show=full
formatgeneral
languageEnglish
publisherIEEE
titlePackaging for power semiconductors based on the 3D printing technology Selective Laser Melting
typeConference Paper
contenttypeMetadata Only
identifier padid8154101
subject keywordsKalman filters
subject keywordsmarine control
subject keywordsmobile robots
subject keywordsmotion control
subject keywordsmotion estimation
subject keywordsnonlinear filters
subject keywordspath planning
subject keywordsrobot dynamics
subject keywordstelerobotics
subject keywordsautonomous surface craft
subject keywordshigh accuracy motion control
subject keywordsmotion estimation
subject keywordsnavigation algorithms
subject keywordsnonlinear 3DOF dynamical model
subject keywordsparameter estimation
subject keywordsslowly varying parameters
subject keywordsunmanned surface crafts
subject keywordsunscented Kalman filter
subject keywordsunscented Kalman filter algorithm
subject keywordswater currents
subject keywordsEquations
subject keywordsGlobal Positioning System
subject keywordsKalman filters
subject keywordsMathematical model
identifier doi10.1109/MED.2014.6961421
journal titleower Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference on
filesize1727169
citations0
contributor rawauthorConrad, M. , De Doncker, R.W. , Schniedenharn, M. , Diatlov, A.


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