An optimization approach to bearing-only visual homing with applications to a 2-D unicycle model
نویسنده:
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/ICEPT.2014.6922693
کلیدواژه(گان): ball grid arrays,cracks,reflow soldering,reliability,backward compatible assembled BGA joint,crack phenomenon,low-melting point alloy re-melting process,mixed BGA joint solder quality,mixed BGA joint solder reliability,reflow process,soldering process,waving process,Joints,Lead,Reflow soldering,Reliability,cracking mechanism,low melting point alloy,mixed BGA joint,reliability
کالکشن
:
-
آمار بازدید
An optimization approach to bearing-only visual homing with applications to a 2-D unicycle model
Show full item record
| contributor author | Tron, R. , Daniilidis, K. | |
| date accessioned | 2020-03-12T20:48:40Z | |
| date available | 2020-03-12T20:48:40Z | |
| date issued | 2014 | |
| identifier other | 6907475.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1026338 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | An optimization approach to bearing-only visual homing with applications to a 2-D unicycle model | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8151365 | |
| subject keywords | ball grid arrays | |
| subject keywords | cracks | |
| subject keywords | reflow soldering | |
| subject keywords | reliability | |
| subject keywords | backward compatible assembled BGA joint | |
| subject keywords | crack phenomenon | |
| subject keywords | low-melting point alloy re-melting process | |
| subject keywords | mixed BGA joint solder quality | |
| subject keywords | mixed BGA joint solder reliability | |
| subject keywords | reflow process | |
| subject keywords | soldering process | |
| subject keywords | waving process | |
| subject keywords | Joints | |
| subject keywords | Lead | |
| subject keywords | Reflow soldering | |
| subject keywords | Reliability | |
| subject keywords | cracking mechanism | |
| subject keywords | low melting point alloy | |
| subject keywords | mixed BGA joint | |
| subject keywords | reliability | |
| identifier doi | 10.1109/ICEPT.2014.6922693 | |
| journal title | obotics and Automation (ICRA), 2014 IEEE International Conference on | |
| filesize | 657640 | |
| citations | 0 |