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Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration

date accessioned2020-03-12T20:43:41Z
date available2020-03-12T20:43:41Z
date issued2014
identifier other6886154.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1023308?show=full
formatgeneral
languageEnglish
publisherIEEE
titleSurface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration
typeConference Paper
contenttypeMetadata Only
identifier padid8148130
subject keywordscomputational complexity
subject keywordsfiltering theory
subject keywordsimage matching
subject keywordsstereo image processing
subject keywordscomputational complexity
subject keywordsconnected weight propagation
subject keywordsfull-image guided filtering
subject keywordsstereo matching
subject keywordsAccuracy
subject keywordsComputational complexity
subject keywordsFiltering algorithms
subject keywordsMatched filters
subject keywordsSignal processing algorithms
subject keywordsStereo vision
subject keywordseight-connected weight propagation
subject keywordsfull-image guided filtering
subject keywordslocal stereo matching
identifier doi10.1109/ICPR.2014.423
journal titleow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
filesize585477
citations0
contributor rawauthorIto, Y. , Fukushima, T. , Lee, K.-W. , Choki, K. , Tanaka, T. , Koyanagi, M.


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