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Low temperature wafer bonding for wafer-level 3D integration

contributor authorDragoi, V. , Rebhan, B. , Burggraf, J. , Razek, N.
date accessioned2020-03-12T20:43:40Z
date available2020-03-12T20:43:40Z
date issued2014
identifier other6886148.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1023302?show=full
formatgeneral
languageEnglish
publisherIEEE
titleLow temperature wafer bonding for wafer-level 3D integration
typeConference Paper
contenttypeMetadata Only
identifier padid8148124
subject keywordsBayes methods
subject keywordsatmospheric optics
subject keywordsmoisture
subject keywordsneural nets
subject keywordsremote sensing
subject keywordssoil
subject keywordsAquarius/SAC-D observations
subject keywordsArgentina
subject keywordsBayesian algorithm
subject keywordsH-pol single channel algorithm
subject keywordsPampas Plains
subject keywordsSMOS Level-2 sm product
subject keywordsV-pol single channel algorithm
subject keywordsartificial neural network
subject keywordsbrightness temperature
subject keywordsmicrowave polarization difference algorithm
subject keywordsoptical depth
subject keywordsretrieval algorithms
subject keywordssoil moisture
subject keywordsArtificial neural networks
subject keywordsBayes methods
subject keywordsMeasurement
subject keywordsOptical sensors
subject keywordsSoil moisture
subject keywordsTraining
subject keywordsVegetation
identifier doi10.1109/IGARSS.2014.6946967
journal titleow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
filesize866107
citations0


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