A cost efficient online algorithm for automotive idling reduction
Publisher:
Year
: 2014DOI: 10.1109/ICSENS.2014.6985473
Keyword(s): Bonding,Cavity resonators,Gold,Micromechanical devices,Packaging,Sensors,Au-Sn Eutectic Bonding,Vertical Feedthroughs,Wafer Level Hermetic Packaging
Collections
:
-
Statistics
A cost efficient online algorithm for automotive idling reduction
Show full item record
| contributor author | Chuansheng Dong , Haibo Zeng , Minghua Chen | |
| date accessioned | 2020-03-12T20:39:00Z | |
| date available | 2020-03-12T20:39:00Z | |
| date issued | 2014 | |
| identifier other | 6881419.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1020668?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | A cost efficient online algorithm for automotive idling reduction | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8145202 | |
| subject keywords | Bonding | |
| subject keywords | Cavity resonators | |
| subject keywords | Gold | |
| subject keywords | Micromechanical devices | |
| subject keywords | Packaging | |
| subject keywords | Sensors | |
| subject keywords | Au-Sn Eutectic Bonding | |
| subject keywords | Vertical Feedthroughs | |
| subject keywords | Wafer Level Hermetic Packaging | |
| identifier doi | 10.1109/ICSENS.2014.6985473 | |
| journal title | esign Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE | |
| filesize | 343437 | |
| citations | 0 |