date accessioned | 2020-03-12T20:38:50Z | |
date available | 2020-03-12T20:38:50Z | |
date issued | 2014 | |
identifier other | 6881335.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1020587?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Contactless stacked-die testing for pre-bond interposers | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8145104 | |
subject keywords | Internet | |
subject keywords | data analysis | |
subject keywords | security of data | |
subject keywords | smart phones | |
subject keywords | Internet | |
subject keywords | confirmatory factor analysis | |
subject keywords | data analysis method | |
subject keywords | information security awareness measurement | |
subject keywords | information security awareness program | |
subject keywords | information security management elements | |
subject keywords | information security threats | |
subject keywords | knowledge dimension | |
subject keywords | security awareness level | |
subject keywords | smart phone users | |
subject keywords | telecommunication industry | |
subject keywords | telecommunication provider | |
subject keywords | Analytical models | |
subject keywords | Information security | |
subject keywords | Load modeling | |
subject keywords | Mobile communication | |
subject keywords | Organizations | |
subject keywords | awareness | |
identifier doi | 10.1109/ISTMET.2014.6936509 | |
journal title | esign Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE | |
filesize | 1024786 | |
citations | 0 | |
contributor rawauthor | Jui-Hung Chien , Ruei-Siang Hsu , Hsueh-Ju Lin , Ka-Yi Yeh , Shih-Chieh Chang | |