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Contactless stacked-die testing for pre-bond interposers

date accessioned2020-03-12T20:38:50Z
date available2020-03-12T20:38:50Z
date issued2014
identifier other6881335.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1020587?show=full
formatgeneral
languageEnglish
publisherIEEE
titleContactless stacked-die testing for pre-bond interposers
typeConference Paper
contenttypeMetadata Only
identifier padid8145104
subject keywordsInternet
subject keywordsdata analysis
subject keywordssecurity of data
subject keywordssmart phones
subject keywordsInternet
subject keywordsconfirmatory factor analysis
subject keywordsdata analysis method
subject keywordsinformation security awareness measurement
subject keywordsinformation security awareness program
subject keywordsinformation security management elements
subject keywordsinformation security threats
subject keywordsknowledge dimension
subject keywordssecurity awareness level
subject keywordssmart phone users
subject keywordstelecommunication industry
subject keywordstelecommunication provider
subject keywordsAnalytical models
subject keywordsInformation security
subject keywordsLoad modeling
subject keywordsMobile communication
subject keywordsOrganizations
subject keywordsawareness
identifier doi10.1109/ISTMET.2014.6936509
journal titleesign Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE
filesize1024786
citations0
contributor rawauthorJui-Hung Chien , Ruei-Siang Hsu , Hsueh-Ju Lin , Ka-Yi Yeh , Shih-Chieh Chang


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