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On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective

date accessioned2020-03-12T20:38:49Z
date available2020-03-12T20:38:49Z
date issued2014
identifier other6881331.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1020583?show=full
formatgeneral
languageEnglish
publisherIEEE
titleOn enhancing power benefits in 3D ICs: Block folding and bonding styles perspective
typeConference Paper
contenttypeMetadata Only
identifier padid8145100
subject keywordsWeb sites
subject keywordsrecommender systems
subject keywordsrelevance feedback
subject keywordsWeb page recommender systems
subject keywordspersonalized snippet generation
subject keywordspersonalized summarization model
subject keywordsrelevance judgment
subject keywordsuseful information
subject keywordsBipartite graph
subject keywordsCollaboration
subject keywordsRecommender systems
subject keywordsRedundancy
subject keywordsSearch engines
subject keywordsVectors
subject keywordsWeb pages
identifier doi10.1109/WI-IAT.2014.101
journal titleesign Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE
filesize2468942
citations0
contributor rawauthorMoongon Jung , Taigon Song , Yang Wan , Yarui Peng , Sung Kyu Lim


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