Search

Now showing items 1-7 of 7

Packages for Fast Switching HV GaN Power Devices

Type: Conference Paper

Author : Klein, Kirill , Hoene, Eckart , Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding

Type: Conference Paper

Author : Zoschke, Kai; Fischer, Thorsten; Oppermann, Hermann; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer

Type: Conference Paper

Author : Brusberg, Lars; Manessis, Dionysios; Neitz, Marcel; Schild, Beatrice; Schroder, Henning; Tekin, Tolga; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations

Type: Conference Paper

Author : Muller, Matthias; Wohrmann, Markus; Wittler, Olaf; Bader, Volker; Topper, Michael; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Assessment of high temperature reliability of molded smart power modules

Type: Conference Paper

Author : Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; van Dijk, Marius; Wittler, Olaf; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology

Type: Conference Paper

Author : Brusberg, Lars; Herbst, Christian; Neitz, Marcel; Schroder, Henning; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Optimization of microstrip-to-via transition for highspeed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads

Type: Conference Paper

Author : Duan, Xiaomin; Hardock, Andreas; Ndip, Ivan; Schuster, Christian; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Search

Packages for Fast Switching HV GaN Power Devices

Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding

Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations

Assessment of high temperature reliability of molded smart power modules

Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology

Optimization of microstrip-to-via transition for highspeed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Packages for Fast Switching HV GaN Power Devices

Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding

Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling &#x2014; Correlation of experiments with finite element simulations

Assessment of high temperature reliability of molded smart power modules

Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology

Optimization of microstrip-to-via transition for highspeed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations