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نمایش تعداد 1-10 از 11

Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

نوع: Journal Paper

نویسنده : Song, Eunseok; Koo, Kyoungchoul; Pak, Jun So; Kim, Joungho

سال: 2013

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Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

نوع: Conference Paper

نویسنده : Song, Eunseok; Jung, Daniel H.; Kim, Youngwoo; Kim, Joungho

ناشر: IEEE

سال: 2014

Harmonic current reduction method of hand-held resonant magnetic field charger (HH-RMFC) for electric vehicle

نوع: Conference Paper

نویسنده : Song, Chiuk; Kim, Hongseok; Jung, Daniel H.; Song, Eunseok; Kim, Sukjin; Kim, Jonghoon; Kim, Joungho

ناشر: IEEE

سال: 2014

Electromagnetic radiated emissions from a wireless power transfer system using a resonant magnetic field coupling

نوع: Conference Paper

نویسنده : Kong, Sunkyu; Kim, Jonghoon; Bae, Bumhee; Kim, Jonghoon J.; Kim, Sukjin; Kim, Joungho

ناشر: IEEE

سال: 2014

Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling

نوع: Conference Paper

نویسنده : Kim, Sukjin; Cho, Yeonje; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Kim, Joungho

ناشر: IEEE

سال: 2014

Analysis of Power Distribution Network in glass, silicon interposer and PCB

نوع: Conference Paper

نویسنده : Kim, Youngwoo; Cho, Kiyeong Kim Jonghyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao

ناشر: IEEE

سال: 2014

Electromagnetic interference and radiation from wireless power transfer systems

نوع: Conference Paper

نویسنده : Kim, Jonghoon; Kim, Hongseok; Song, Chiuk; Kim, In-Myoung; Kim, Young-il; Kim, Joungho

ناشر: IEEE

سال: 2014

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

نوع: Conference Paper

نویسنده : Song, Jinwook; Kim, Sukjin; Bae, Bumhee; Kim, Jonghoon J.; Jung, Daniel H.; Kim, Joungho

ناشر: IEEE

سال: 2014

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

نوع: Journal Paper

نویسنده : Kim, Jiseong; Kim, Jonghoon; Kong, Sunkyu; Kim, Hongseok; Suh, In-Soo; Suh, Nam Pyo; Cho, Dong-Ho; Kim, Joungho; Ahn, Seungyoung

سال: 2013

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Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing

نوع: Conference Paper

نویسنده : Lee, Eunjung; Lee, Manho; Kim, Jonghoon J.; Kim, Mijoo; Kim, Jonghoon; Kim, Joungho; Park, Jeoungkun; Joo, Younghoon; Bang, Yoonhee; Kim, Il; Nam, Seungki

ناشر: IEEE

سال: 2014

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Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

Harmonic current reduction method of hand-held resonant magnetic field charger (HH-RMFC) for electric vehicle

Electromagnetic radiated emissions from a wireless power transfer system using a resonant magnetic field coupling

Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Electromagnetic interference and radiation from wireless power transfer systems

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing

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Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

Harmonic current reduction method of hand-held resonant magnetic field charger (HH-RMFC) for electric vehicle

Electromagnetic radiated emissions from a wireless power transfer system using a resonant magnetic field coupling

Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Electromagnetic interference and radiation from wireless power transfer systems

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing