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Electrical characterization and analysis on the via-solder ball structure

Type: Conference Paper

Author : Yi He; Jun Li; Fengman Liu; Peng Wu; Liqiang Cao

Publisher: IEEE

Year: 2014

Analysis on electromagnetic isolation issues among multi-chips in system in package

Type: Conference Paper

Author : Peng Wu; Fengman Liu; Yi He; Huimin He; Jun Li; Liqiang Cao; Dongkai Shangguan; Lixi Wan

Publisher: IEEE

Year: 2014

Author

Fengman Liu (2)

Jun Li (2)

Liqiang Cao (2)

Peng Wu (2)

Yi He (2)

Dongkai Shangguan (1)

Huimin He (1)

Lixi Wan (1)

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IEEE (2)

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2014 (2)

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Conferences (1)

Semiconductor lasers (1)

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Conference Paper (2)

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English (2)

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Metadata Only (2)

Publication Title

lectronic Packaging Technology (ICEPT), 2014 15th International Conference on (2)

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