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Comparative analysis of novel thermal interface containing nano additives

Type: Conference Paper

Author : Matkowski, Przemyslaw; Falat, Tomasz; Moscicki, Andrzej

Publisher: IEEE

Year: 2014

Heat transfer through the interface containing sintered NanoAg based thermal interface material

Type: Conference Paper

Author : Platek, Bartosz; Falat, Tomasz; Matkowski, Przemyslaw; Felba, Jan; Moscicki, Andrzej

Publisher: IEEE

Year: 2014

Experimental results versus numerical simulations of In/Cu intermetallic compounds growth

Type: Conference Paper

Author : Falat, Tomasz; Platek, Bartosz; Matkowski, Przemyslaw; Felba, Jan; Zanden, Carl; Ye, Li-lei; Liu, Johan

Publisher: IEEE

Year: 2014

Influence of sintering process parameters on mechanical strength of joints based on silver nano particles

Type: Conference Paper

Author : Falat, Tomasz; Stojek, Krzysztof; Matkowski, Przemyslaw; Platek, Bartosz; Felba, Jan; Moscicki, Andrzej

Publisher: IEEE

Year: 2014

Author

Falat, Tomasz (4)

Matkowski, Przemyslaw (4)

Felba, Jan (3)

Moscicki, Andrzej (3)

Platek, Bartosz (3)

Liu, Johan (1)

Stojek, Krzysztof (1)

Ye, Li-lei (1)

Zanden, Carl (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

Arrays (1)

Buildings (1)

consumer behaviour (1)

IEEE 802.15 Standards (1)

n Apriori algorithm (1)

n apriori algorithm (1)

n ARM (1)

n ARM (Association Rule Mining) (1)

n association rule mining (1)

n Association rules (1)

Type

Conference Paper (4)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (3)

lectronics System-Integration Technology Conference (ESTC), 2014 (1)

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