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نمایش تعداد 1-8 از 8

Lead-free Solder Interconnect Reliability

نوع: Ebook

نویسنده : Dongkai Shangguan

سال: 2005

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Cellular Growth of Crystals

نوع: Ebook

نویسنده : Dongkai Shangguan (auth.)

ناشر: Springer Berlin Heidelberg

سال: 1991

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Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

نوع: Conference Paper

نویسنده : Chongshen Song , Wenqi Zhang , Dongkai Shangguan

ناشر: IEEE

سال: 2014

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

نوع: Conference Paper

نویسنده : Huijuan Wang; Jie Pan; Xiaoli Ren; Anmou Liao; Yuan Lu; Daquan Yu; Dongkai Shangguan

ناشر: IEEE

سال: 2014

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

نوع: Conference Paper

نویسنده : Wenya Shang; Cheng Pang; Xiaoli Ren; Zheng Qin; Daquan Yu; Dongkai Shangguan

ناشر: IEEE

سال: 2014

Electrical simulation of thin film inductors on silicon and glass substrates

نوع: Conference Paper

نویسنده : Zheng Qin; Cheng Pang; Xiaoli Ren; Wenya Shang; Dongkai Shangguan; Daquan Yu

ناشر: IEEE

سال: 2014

Analysis on electromagnetic isolation issues among multi-chips in system in package

نوع: Conference Paper

نویسنده : Peng Wu; Fengman Liu; Yi He; Huimin He; Jun Li; Liqiang Cao; Dongkai Shangguan; Lixi Wan

ناشر: IEEE

سال: 2014

Circuit modeling and structure optimization of integrated passive inductors

نوع: Conference Paper

نویسنده : Jie Pan; Huijuan Wang; Delong Qiu; Xiaoli Ren; Yuan Lu; Daquan Yu; Dongkai Shangguan

ناشر: IEEE

سال: 2014

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Lead-free Solder Interconnect Reliability

Cellular Growth of Crystals

Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Electrical simulation of thin film inductors on silicon and glass substrates

Analysis on electromagnetic isolation issues among multi-chips in system in package

Circuit modeling and structure optimization of integrated passive inductors

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Lead-free Solder Interconnect Reliability

Cellular Growth of Crystals

Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Electrical simulation of thin film inductors on silicon and glass substrates

Analysis on electromagnetic isolation issues among multi-chips in system in package

Circuit modeling and structure optimization of integrated passive inductors