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Now showing items 1-10 of 15
Benzo-cyclo-butene bonding process with 'stamp' printing for wafer level package
Publisher: IET
Year: 2014
Electromagnetic Field Analyses of REBCO Roebel Cables Wound Into Coil Configurations
Publisher: IEEE
Year: 2014
Minimum fourier measurements for stable recovery of block sparse signal
Publisher: IEEE
Year: 2014
Development of an online student report management system
Publisher: IEEE
Year: 2014
Do neighbor buddies make a difference in reblog likelihood? An analysis on SINA Weibo data
Publisher: IEEE
Year: 2014
Tag-based expert recommendation in community question answering
Publisher: IEEE
Year: 2014
Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs
Publisher: IEEE
Year: 2014