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نمایش تعداد 1-10 از 39

The effect of thermomechanical treatment on pitting corrosion of 17-4PH stainless steel

نوع: Conference Paper

نویسنده : مژگان ابوئی مهریزی; محمدهادی مؤید; mozhgan abooei mehrizy; Mohammad Hadi Moayed

سال: 2013

خلاصه:

study, the effect of

thermomechanical treatment on pitting corrosion of 17-4

PH stainless steel was investigated in 3.5% NaCl solution

by means of potentiodynamic polarization technique....

Residual Stress Analysis in Nonoriented Electrical Steel Sheets by Barkhausen Noise Measurements

نوع: Journal Paper

نویسنده : Vourna, Polyxeni; Ktena, Aphrodite; Hristoforou, Evangelos

ناشر: IEEE

سال: 2014

Study of Microstructure and Texture Evolution in Grain-Oriented Steels Via Coercivity Measurements

نوع: Journal Paper

نویسنده : Petryshynets, Ivan; Kovac, Frantisek; Sopko, Martin; Marcin, Jozef; Petrov, Branislav

ناشر: IEEE

سال: 2014

DOA Estimation Method using R Matrix of the QR Factorized Data and its Prototype Implementation on NI-PXI Platform

نوع: Conference Paper

نویسنده : Tayem, N.; Omer, M.; Hussain, A.Abul

ناشر: IEEE

سال: 2014

Multi-hop Geographic Transmission Scheme for the Uplink in Mesh Networks

نوع: Conference Paper

نویسنده : Choi, Byonghyok; Shea, John M.

ناشر: IEEE

سال: 2014

Fast Spectrum Sensing: A Combination of Channel Correlation and Markov Model

نوع: Conference Paper

نویسنده : Gao, Mingfei; Yan, Xiao; Zhang, Yuchi; Liu, Chaoyue; Zhang, Yifan; Feng, Zhiyong

ناشر: IEEE

سال: 2014

Decode-and-Forward Relay Selection with Imperfect CSI in Cognitive Relay Networks

نوع: Conference Paper

نویسنده : Sun, Hui; Naraghi-Pour, Mort

ناشر: IEEE

سال: 2014

Particle Swarm Optimization for Design of Slotted MEMS Resonators With Low Thermoelastic Dissipation

نوع: Journal Paper

نویسنده : Lake, Jonathan James; Duwel, Amy E.; Candler, R.N.

ناشر: IEEE

سال: 2014

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

نوع: Journal Paper

نویسنده : Navarro, Luis /A/.; Perpina, Xavier; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, Miquel; Jorda, Xavier

ناشر: IEEE

سال: 2014

Numerical Simulation of Thermomechanical Processes Coupled with Microstructure Evolution

نوع: Journal Paper

نویسنده : Colombo, Tiago C. /A/.; Brito, Alberto M. G.; Schaeffer, Lirio

ناشر: IEEE

سال: 2014

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The effect of thermomechanical treatment on pitting corrosion of 17-4PH stainless steel

Residual Stress Analysis in Nonoriented Electrical Steel Sheets by Barkhausen Noise Measurements

Study of Microstructure and Texture Evolution in Grain-Oriented Steels Via Coercivity Measurements

DOA Estimation Method using R Matrix of the QR Factorized Data and its Prototype Implementation on NI-PXI Platform

Multi-hop Geographic Transmission Scheme for the Uplink in Mesh Networks

Fast Spectrum Sensing: A Combination of Channel Correlation and Markov Model

Decode-and-Forward Relay Selection with Imperfect CSI in Cognitive Relay Networks

Particle Swarm Optimization for Design of Slotted MEMS Resonators With Low Thermoelastic Dissipation

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Numerical Simulation of Thermomechanical Processes Coupled with Microstructure Evolution

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The effect of thermomechanical treatment on pitting corrosion of 17-4PH stainless steel

Residual Stress Analysis in Nonoriented Electrical Steel Sheets by Barkhausen Noise Measurements

Study of Microstructure and Texture Evolution in Grain-Oriented Steels Via Coercivity Measurements

DOA Estimation Method using R Matrix of the QR Factorized Data and its Prototype Implementation on NI-PXI Platform

Multi-hop Geographic Transmission Scheme for the Uplink in Mesh Networks

Fast Spectrum Sensing: A Combination of Channel Correlation and Markov Model

Decode-and-Forward Relay Selection with Imperfect CSI in Cognitive Relay Networks

Particle Swarm Optimization for Design of Slotted MEMS Resonators With Low Thermoelastic Dissipation

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Numerical Simulation of Thermomechanical Processes Coupled with Microstructure Evolution