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نمایش تعداد 1-10 از 21

thermal characteristics of a two_phase closed thermosyphon

نوع: Conference Paper

نویسنده : سیدحسین نوعی باغبان; Seyed Hossein Noie Baghban

سال: 2002

effect of aspect ratio and filling ratio on heat transfer characteristics of a two_phase closed ther

نوع: Conference Paper

نویسنده : سیدحسین نوعی باغبان; Seyed Hossein Noie Baghban

سال: 2000

Effects of nanoparticle volume fraction in hydrodynamic and thermal characteristics of forced plane jet

نوع: Journal Paper

نویسنده : محمد جواد مغربی; Taher Armaghani; F. Talebi; Mohammad Javad Maghrebi

سال: 2012

خلاصه:

The effects of nanoparticle volume fraction in hydrodynamic and thermal characteristics of an incompressible forced 2-D plane jet flow are investigated. Direct Numerical Simulation (DNS) of a two dimensional incompressible plane forced jet flow...

Thermal Characteristics of a Tow-Phase Closed Thermosyphon ( مشخصات گرمایی یک ترموسیفون بسته دو فاز )

نوع: Conference Paper

نویسنده : سیدحسین نوعی باغبان; M.Kalaei; R. Sanati; Seyed Hossein Noie Baghban; M.Kalaei; R. Sanati

سال: 2002

خلاصه:

Thermal Characteristics of a Tow-Phase Closed Thermosyphon ( مشخصات گرمایی یک ترموسیفون بسته دو فاز )...

Optical Pump Induced Thermal Sensitivity Reduction in a Minimized Er/Yb-Codoped-Fiber Mach–Zehnder Interferometer

نوع: Journal Paper

نویسنده : Bo Dong; Nan-Kuang Chen; Gia-Ling Cheng; Changyuan Yu; Yandong Gong

ناشر: IEEE

سال: 2014

Demonstration of Reduced Power Consumption MEMS LEL Sensor Prepared by a Novel Digital Microfluid Technique

نوع: Journal Paper

نویسنده : Lin Yang; Zhimin Zhou

ناشر: IEEE

سال: 2014

Prolog to "Rugged Electrical Power Switching in Semiconductors: A Systems Approach"

نوع: Journal Paper

نویسنده : Esch, J.

ناشر: IEEE

سال: 2014

Evaluation on Electrical and Thermal Characteristics of Multi-Stacked HTS Coated Conductor With Various Stabilizers

نوع: Journal Paper

نویسنده : Young Gun Park; Young Jin Hwang; Jae Young Jang; Hyung Jun Kim; Woo Seung Lee; Hyun Chul Jo; Ho Min Kim; Yong Soo Yoon; Tae Kuk Ko

ناشر: IEEE

سال: 2014

Investigation of Quilt Packaging Interchip Interconnect With Solder Paste

نوع: Journal Paper

نویسنده : Quanling Zheng; Kopp, David; Khan, Muhammad Asad; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H.

ناشر: IEEE

سال: 2014

Optimal design of LLC resonant converter with improved controllability

نوع: Conference Paper

نویسنده : Khoobroo, E. , Ashrafinia, B. , Akhbari, M.

ناشر: IEEE

سال: 2014

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thermal characteristics of a two_phase closed thermosyphon

effect of aspect ratio and filling ratio on heat transfer characteristics of a two_phase closed ther

Effects of nanoparticle volume fraction in hydrodynamic and thermal characteristics of forced plane jet

Thermal Characteristics of a Tow-Phase Closed Thermosyphon ( مشخصات گرمایی یک ترموسیفون بسته دو فاز )

Optical Pump Induced Thermal Sensitivity Reduction in a Minimized Er/Yb-Codoped-Fiber Mach–Zehnder Interferometer

Demonstration of Reduced Power Consumption MEMS LEL Sensor Prepared by a Novel Digital Microfluid Technique

Prolog to "Rugged Electrical Power Switching in Semiconductors: A Systems Approach"

Evaluation on Electrical and Thermal Characteristics of Multi-Stacked HTS Coated Conductor With Various Stabilizers

Investigation of Quilt Packaging Interchip Interconnect With Solder Paste

Optimal design of LLC resonant converter with improved controllability

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thermal characteristics of a two_phase closed thermosyphon

effect of aspect ratio and filling ratio on heat transfer characteristics of a two_phase closed ther

Effects of nanoparticle volume fraction in hydrodynamic and thermal characteristics of forced plane jet

Thermal Characteristics of a Tow-Phase Closed Thermosyphon ( مشخصات گرمایی یک ترموسیفون بسته دو فاز )

Optical Pump Induced Thermal Sensitivity Reduction in a Minimized Er/Yb-Codoped-Fiber Mach&#x2013;Zehnder Interferometer

Demonstration of Reduced Power Consumption MEMS LEL Sensor Prepared by a Novel Digital Microfluid Technique

Prolog to "Rugged Electrical Power Switching in Semiconductors: A Systems Approach"

Evaluation on Electrical and Thermal Characteristics of Multi-Stacked HTS Coated Conductor With Various Stabilizers

Investigation of Quilt Packaging Interchip Interconnect With Solder Paste

Optimal design of LLC resonant converter with improved controllability

Optical Pump Induced Thermal Sensitivity Reduction in a Minimized Er/Yb-Codoped-Fiber Mach–Zehnder Interferometer