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Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.

Type: Journal Paper

Author : Leroux, Delphine J.; Kerr, Yann H.; Al Bitar, Ahmad; Bindlish, Rajat; Jackson, Thomas J.; Berthelot, Beatrice; Portet, Gautier

Publisher: IEEE

Year: 2014

Convergence and disagreement analysis of opinion dynamics

Type: Conference Paper

Author : Yinghui Wang

Publisher: IEEE

Year: 2014

Clarifications on the “Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.”

Type: Journal Paper

Author : Wagner, Wolfgang; Brocca, Luca; Naeimi, Vahid; Reichle, R.; Draper, Conny; de Jeu, R.; Ryu, Dongryeol; Chun-Hsu Su; Western, Andrew; Calvet, Jean-Christophe; Kerr, Yann H.; Leroux, Delphine J.; Drusch, Matthias; Jackson, Thomas J.; Hahn, Seungyong; Dorigo, Wouter; Paulik, Christoph

Publisher: IEEE

Year: 2014

Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

Type: Conference Paper

Publisher: IEEE

Year: 2014

Impact of quality control of satellite soil moisture data on their assimilation into land surface model

Type: Journal Paper

Publisher: American Geophysical Union

Year: 2014

Surface layer analysis of Si sphere by XRF and XPS

Type: Conference Paper

Publisher: IEEE

Year: 2014

TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

Type: Conference Paper

Publisher: IEEE

Year: 2014

An Observing System Simulation Experiment for the Aquarius/SAC-D Soil Moisture Product

Type: Journal Paper

Author : Bruscantini, Cintia /A/.; Crow, Wade T.; Grings, Francisco; Perna, Pablo; Maas, Marco; Karszenbaum, Haydee

Publisher: IEEE

Year: 2014

The design and implement of aviation battery charging and discharging system

Type: Conference Paper

Author : Chengtao Cai , Chao Yang , Xiaolong Lv

Publisher: IEEE

Year: 2014

Process integration, improvements, and testing of Si interposers for embedded computing applications

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.

Convergence and disagreement analysis of opinion dynamics

Clarifications on the “Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.”

Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

Impact of quality control of satellite soil moisture data on their assimilation into land surface model

Surface layer analysis of Si sphere by XRF and XPS

TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

An Observing System Simulation Experiment for the Aquarius/SAC-D Soil Moisture Product

The design and implement of aviation battery charging and discharging system

Process integration, improvements, and testing of Si interposers for embedded computing applications

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Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.

Convergence and disagreement analysis of opinion dynamics

Clarifications on the &#x201C;Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.&#x201D;

Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

Impact of quality control of satellite soil moisture data on their assimilation into land surface model

Surface layer analysis of Si sphere by XRF and XPS

TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

An Observing System Simulation Experiment for the Aquarius/SAC-D Soil Moisture Product

The design and implement of aviation battery charging and discharging system

Process integration, improvements, and testing of Si interposers for embedded computing applications

Clarifications on the “Comparison Between SMOS, VUA, ASCAT, and ECMWF Soil Moisture Products Over Four Watersheds in U.S.”