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    Fabrication of walk-off compensating wavelength-conversion devices with stacks of multiple plates by use of room-temperature bonding 

    Type: Conference Paper
    Author : Ariga, Y. , Onda, T. , Kubota, W. , Shoji, I.
    Publisher: IEEE
    Year: 2014

    Dynamic Vehicle Redistribution and Online Price Incentives in Shared Mobility Systems 

    Type: Journal Paper
    Author : Pfrommer, Julius; Warrington, Joseph; Schildbach, Georg; Morari, Manfred
    Publisher: IEEE
    Year: 2014

    DEAR: Delay-Guaranteed Energy Profile-Aware Routing Toward the Green Internet 

    Type: Journal Paper
    Author : Eun-Jung Lee; Young-Min Kim; Hong-Shik Park
    Publisher: IEEE
    Year: 2014

    Voltage-Aware Chip-Level Design for Reliability-Driven Pin-Constrained EWOD Chips 

    Type: Journal Paper
    Author : Sheng-Han Yeh; Jia-Wen Chang; Tsung-Wei Huang; Shang-Tsung Yu; Tsung-Yi Ho
    Publisher: IEEE
    Year: 2014

    Relay-by-smartphone: realizing multihop device-to-device communications 

    Type: Journal Paper
    Author : Nishiyama, Hiroki; Ito, Minora; Kato, Nei
    Publisher: IEEE
    Year: 2014

    Approach for RFID tag measurement data modeling 

    Type: Conference Paper
    Author : Gimpilevich, Yu.B.; Savochkin, D.A.
    Publisher: IEEE
    Year: 2014

    A first-prototype of the claw pole type half-wave rectified variable field flux motor 

    Type: Conference Paper
    Author : Abe, T.; Oba, R.; Higuchi, T.
    Publisher: IEEE
    Year: 2014

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