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    Improved Thermal Performance of SOI Using a Compound Buried Layer 

    Type: Journal Paper
    Author : Baine, P.; Montgomery, John H.; Armstrong, B. Mervyn; Gamble, Harold S.; Harrington, Sarah J.; Nigrin, Sydney; Wilson, Richard; Oo, Kean B.; Armstrong, Alastair G.; Suder, Suli
    Publisher: IEEE
    Year: 2014

    Considerations for sending a breaker trip command over great distances for the purpose of arc flash mitigation 

    Type: Conference Paper
    Author : Proctor, M.
    Publisher: IEEE
    Year: 2014

    Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module 

    Type: Journal Paper
    Author : Wei Kexin; Du Mingxing; Xie Linlin; Li Jian
    Publisher: IEEE
    Year: 2014

    Object following control of six-legged robot using Kinect camera 

    Type: Conference Paper
    Author : Gulalkari, Amruta Vinod; Hoang, Giang; Pratama, Pandu Sandi; Kim, Hak Kyeong; Kim, Sang Bong; Jun, Bong Huan
    Publisher: IEEE
    Year: 2014

    Characterization of 6.5 kV IGBTs for High-Power Medium-Frequency Soft-Switched Applications 

    Type: Journal Paper
    Author : Dujic, Drazen; Steinke, Gina K.; Bellini, M.; Rahimo, Munaf; Storasta, Liutauras; Steinke, Juergen K.
    Publisher: IEEE
    Year: 2014

    An Active Power-Decoupling Method for Single-Phase AC–DC Converters 

    Type: Journal Paper
    Author : Mei Su; Pan Pan; Xi Long; Yao Sun; Jian Yang
    Publisher: IEEE
    Year: 2014

    Modular Multilevel Converter Models for Electromagnetic Transients 

    Type: Journal Paper
    Author : Saad, Hasnida; Dennetiè re, Sé bastien; Mahseredjian, J.; Delarue, P.; Guillaud, Xavier; Peralta, J.; Nguefeu, Samuel
    Publisher: IEEE
    Year: 2014

    Bi-manual gesture interaction for 3D cloud point selection and annotation using COTS 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    [Copyright notice] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Cloud Computing: A New Age of Computing 

    Type: Conference Paper
    Author : Gill, G.S. , Wadhwa, A. , Jatain, A.
    Publisher: IEEE
    Year: 2014
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