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    Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies 

    Type: Conference Paper
    Author : Bum, Lee Jong; Li, Jerry Aw Jie; Woo, Daniel Rhee Min
    Publisher: IEEE
    Year: 2014

    Aging effect on creep properties of SnBi solders 

    Type: Conference Paper
    Author : Sakane, Masao; Yagi, Kota; Itoh, Takamoto; Yamashita, Mitsuo; Hokazono, Hiroaki
    Publisher: IEEE
    Year: 2014

    Design and implementation of an electromagnetic clutch system for hub motors 

    Type: Conference Paper
    Author : Weiguang Yu; Chenglin Gu
    Publisher: IEEE
    Year: 2014

    Real-time 3D electrical impedance imaging for ventilation monitoring of the lung: Pilot study 

    Type: Conference Paper
    Author : Amm, B.; Tzu-Jen Kao; Xin Wang; Boverman, G.; Shoudy, D.; Sabatini, J.; Ashe, J.; Newell, J.; Saulnier, G.; Isaacson, D.; Davenport, D.
    Publisher: IEEE
    Year: 2014

    Performance evaluation of relay site planning 

    Type: Conference Paper
    Author : Srinivasan, S.; Sathish, K.; Saminadan, V.
    Publisher: IEEE
    Year: 2014

    Secrecy rate optimization for a MIMO secrecy channel based on Stackelberg game 

    Type: Conference Paper
    Author : Chu, Zheng; Cumanan, Kanapathippillai; Ding, Zhiguo; Johnston, Martin; Goff, Stephane Le
    Publisher: IEEE
    Year: 2014

    Intense and short millimeter wave pulse generation by using a gyrotron as a light source 

    Type: Conference Paper
    Author : Mitsudo, S.; Tanaka, T.; Umegaki, C.; Fujii, Y.
    Publisher: IEEE
    Year: 2014

    A 5.4 <formula formulatype="inline"> <img src="/images/tex/19099.gif" alt="\\mu{\\rm W}"> </formula> Soft-Decision BCH Decoder for Wireless Body Area Networks 

    Type: Journal Paper
    Author : Chia-Hsiang Yang; Ting-Ying Huang; Mao-Ruei Li; Yeong-Luh Ueng
    Publisher: IEEE
    Year: 2014

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