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Analysis of Flip Chip Bonding for Performance Stability of UHF RFID Tags

Type: Journal Paper

Author : Jaeyul Choo; Jeongki Ryoo

Publisher: IEEE

Year: 2014

A Low RF-Band Impedance Spectroscopy Based Sensor for <italic>In Situ</italic>, Wireless Soil Sensing

Type: Journal Paper

Author : Pandey, G.K.; Kumar, Ravindra; Weber, Robert J.

Publisher: IEEE

Year: 2014

Modeling of Capacitance Characteristics of Printed p-Type Organic Thin-Film Transistors

Type: Journal Paper

Author : Valletta, A.; Rapisarda, M.; Calvi, S.; Fortunato, G.; Jacob, S.; Fischer, V.; Benwadih, M.; Bablet, J.; Chartier, I.; Coppard, R.; Mariucci, L.

Publisher: IEEE

Year: 2014

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Analysis of Flip Chip Bonding for Performance Stability of UHF RFID Tags

A Low RF-Band Impedance Spectroscopy Based Sensor for <italic>In Situ</italic>, Wireless Soil Sensing

Modeling of Capacitance Characteristics of Printed p-Type Organic Thin-Film Transistors

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Analysis of Flip Chip Bonding for Performance Stability of UHF RFID Tags

A Low RF-Band Impedance Spectroscopy Based Sensor for <italic>In Situ</italic>, Wireless Soil Sensing

Modeling of Capacitance Characteristics of Printed p-Type Organic Thin-Film Transistors